Thermal analysis is an effective way to determine various characteristic thermo-physical material properties such as the glass transition temperature, melting point, dissociation temperature, heat capacity (Cp), coefficient of thermal expansion (CTE/a) elastic moduli and temperature dependent weight changes. TA is particularly suitable for the characterisation of polymeric materials.

TGA-Analysist

Test Methods

• Differential Scanning Calorimetry (DSC):
  By monitoring the heat flow between a sample and a reference substance as a function of temperature or time, whilst they are subjected to a controlled temperature regime, materials properties such as T_g, T_m, T_ox, ∆H, a, c_p may be determined.
• Thermogravimetry (TGA):
  The thermal decomposition behaviour of a material is monitored by recording weight change in a sample as a function of temperature.
• Dynamic-mechanical Analysis (DMA):
  DMA is used to determine the mechanical properties of a material as a function of temperature, time and the frequency of an applied oscillating load. To do this, the visco-elstic material is loaded with a defined frequency of vibrations and the phase shift of the material response is recorded and analysed.
• Thermomechanical Analysis (TMA):
  This method is used to determine the dimensional change in a solid or paste-like material as a function of temperature. In addition to length changes, the thermomechanical properties, of visco-elastic materials in particular, can be characterised. Such materials exhibit pronounced changes in expansion behaviour when undergoing phase changes, transformations or relaxation.

E-modulus vs. Temperature of a polymer blend determined by DMA	DSC-curves of PET. PE and PMMA

Examples of applications

• Identification of types of polymer, and compositions of compounds and blends including their softener and filler content
• Creep, relaxation and visco-elastic properties
• Aging and decomposition behaviour
• Feedstock management, quality control, contamination, moisture
• Optimisation of processing, shrinkage, distortion, residual stress

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